高級工程師，熱機械應力分析工程

This position shall be located in Shanghai.
？ Summary
This engineer will be Junior Thermal Mechanical Stress Simulation Engineer for advanced package and SiP (system-in-package). Successful candidate should understand the thermal mechanical stress moｄｅｌing and simulation of advanced computing and SiP module, reliability test application, material ｃｈａｒacterization. Candidates would work with worldwide design team to evaluate and review, sign-off performance approval of customer product designs. Familiarity with advanced packaging techniques is required.
Key Qualifications:
1、MS degree in thermal, mechanical +2 years’ experience is required, PhD degree in ME +3 years is preferred;
2、Prior experience in high performance computing and/or System-in-Package (SiP) design preferred
3、Solid FEA fundamentals and expertise in mechanical thermal moｄｅｌing in SiP module.
Hands-on skills with design simulation tools or equivalent FEA tools, ANSYS mechanical, Abaqus, AutoCAD
4、Solid expertise in thermal mechanical test and material ｃｈａｒacterization for high performance computing and SiP, including JEDEC 51 series, live product validation etc.
5、Familiar with semiconductor packaging technologies such as laminate, LTCC, WB, WLCSP, Flip Chip CSP, SMT components, IPD, and AiP.
Preferred Skills:
Strong communication skills, Proficient English language capability, experience work with global team members of different cultural backgrounds.
Key Responsibilities
(1)Conducting thermal mechanical stress simulation project by technical expertise to bring solutions to new products
(2)Participating in product design development, ｃｈａｒacterization, and volume production test strategy for high-performance, high-volume semiconductor package
(3)Deep understanding of thermal mechanical moｄｅｌing and simulation of complete system including high performance semiconductor chips and SiP modules
(4)Familiar with and knowledge of JEDEC thermal and reliability spec,
(5)Participating customer product discussion and spec lock
(6)Generating IP’s for the company.

上班地址：-上海-金橋鎮錦繡東路2777弄華虹創新園29幢